Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw (1 EA / EA)

  • SKU230-14315
  • Brand
  • Manufacturer Part #14315
  • Available to Order

    Expected to Arrive ***


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$34.50

Devcon HP 250 Epoxy, 50 mL, Dev-Pak, Straw (1 EA / EA) Specifications

  • Adhesive Tensile Shear:
    3
  • Applicable Materials:
    Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
  • Applications:
    Multi-Purpose
  • Base Type:
    Epoxy
  • Capacity Vol. [Nom]:
    50 mL
  • Chemical Compound:
    Epoxy
  • Color:
    Straw
  • Dielectric Strength:
    490 V/mil
  • Elongation [Nom]:
    25%
  • Fix Cure Time @ Temp.:
    6 h @ 72 °F
  • Full Cure Time @ Temp.:
    7 d @ 72 °F
  • Hardness [Nom]:
    78 Shore D
  • Height [Nom]:
    3 1/4 in
  • Length [Nom]:
    7 1/4 in
  • Material:
    Thixotropic Paste
  • Odor/Scent:
    Low
  • Packing Type:
    Dev-Pak
  • Physical Form:
    Solid
  • Ratio:
    2:1
  • Resistance:
    Chlorinated Solvents; Kerosene; Moisture; Water; Weather
  • Temp. Range [Max]:
    250 °F
  • Temp. Range [Min]:
    -67 °F
  • Tensile Strength [Nom]:
    3
  • Type:
    Adhesive
  • Usage:
    Structural Bonding
  • Viscosity [Nom]:
    105
  • Width [Nom]:
    6 in
  • Working Time [Nom]:
    65 min

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Description

High-performance, gap-filling thixotropic paste for structural bonding applications
Superior toughness, impact and chemical resistant
Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
Excellent gap fill.

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