Devcon HP 250 Epoxy, 400 mL, Cartridge, Straw (12 EA / CA) Specifications
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Adhesive Tensile Shear:3
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Applicable Materials:Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
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Application Temp. Range [Max]:250 °F
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Application Temp. Range [Min]:-67°F
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Applications:Multi-Purpose
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Base Type:Epoxy
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Capacity Vol. [Nom]:400 mL
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Chemical Compound:Epoxy
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Color:Straw
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Dielectric Strength:490 V/mil
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Elongation [Nom]:25%
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Fix Cure Time @ Temp.:6 h @ 72°F
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Flash Point [Nom]:200°F
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Full Cure Time @ Temp.:7 d @ 72 °F
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Hardness [Nom]:78 Shore D
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Material:Thixotropic Paste
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Odor/Scent:Low
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Packing Type:Cartridge
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Physical Form:Paste
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Ratio:2:1
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Resistance:Chlorinated Solvents; Kerosene; Moisture; Water; Weather
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Specific Gravity [Nom]:1.0
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Temp. Range [Max]:250 °F
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Temp. Range [Min]:-67 °F
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Tensile Strength [Nom]:3
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Type:Adhesive
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Usage:Structural Bonding
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Viscosity [Nom]:Resin: 120
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Width [Nom]:400mL
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Working Time [Nom]:65 min
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Description
High-performance, gap-filling thixotropic paste for structural bonding applications
Superior toughness, impact and chemical resistant
Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
Excellent gap fill.
Superior toughness, impact and chemical resistant
Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
Excellent gap fill.